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Solderability of PCBs Surface Treatments and Environmental Influences
Jičínský, Jiří ; Zatloukal, Miroslav (referee) ; Starý, Jiří (advisor)
This bachelor’s thesis deals with the properties of surface treatment of printed circuit boards. The main purpose of this work is to compare the OSP coating applied under laboratory conditions and the technological procedure established in the company ČEMEBO Blansko. Samples of ENIG, immersion tin and OSP compare due to their critical aspects. In the practical part, the samples au exposed to various elements of nature according to ČSN EN 60068-2. The surface wetting balance method will be used for better comparison and evaluation.
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Wettability of PCB Surface Finishes and Comparison of Methods
Vídeňský, Ondřej ; Přikryl, Tomáš (referee) ; Starý, Jiří (advisor)
This bachelor´s thesis deals with testing methods for surface finishe´s wettability PCB. For this tests has been designed and created testing board which contains testing coupons for testing methods. Boards have been created and covered by surface finishes by Gatema Boskovice. In this thesis electroless nickel with immersion gold (ENIG) and immersion tin have been tested. For simulation of reflow soldering have been used test methods solder indicator, solder spread test and dewetting test. Wetting balance test method has been used as simulation of wave soldering.
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Quality of PCB Surface Finishes and Test Coupon Optimization
Minář, Jan ; Přikryl, Tomáš (referee) ; Starý, Jiří (advisor)
This master’s thesis deals with measuring and evaluation of wetting for samples of different surface finishes, using a test coupon developed in cooperation with firm Gatema. It deals with surface finishes ENIG and immersion tin. For these samples deals with quality monitoring and periodic testing of these surface finishes. The solder using for tests is SAC305. Test methods are used for simulation of reflow soldering and wave soldering.
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Immersion Tin Surface Finish of PCB
Karzel, Vítězslav ; Zatloukal, Miroslav (referee) ; Starý, Jiří (advisor)
The aim of this work is to study and more deeply understand everything about surface finishing of the printed circuit boards, that are used for lead-free soldering. Mainly we should focus on immersion tin and prepare some fundamental information for future measurement. Therefore, in the first part of the thesis is our main task is to create a~sufficient theoretical background for printed circuit boards, immersion tin and solderability. Then we are able to use previously created theoretical background to measure selected samples. Thereafter the measured data can be used for more strict evaluation, from which the results of measurement can be obtained.
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Surface Finishes of Copper in PCBś Production
Bedlek, Marek ; Zatloukal, Miroslav (referee) ; Starý, Jiří (advisor)
This work examines and compares properties of different types of surface finishes, their qualities and shortcomings and perspective for future use. Emphasis is placed on new product in the field of OSP, Glicoat F2 from SHIKOKU CHEMICALS CORPORATION and immersion tin. It evaluates their influence on solderability and its changes after several reflow cycles and isothermal aging.
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WETTABILITY OF PCB SURFACE FINISHES
Minář, Jan ; Jana, Toulová (referee) ; Starý, Jiří (advisor)
This bachelor’s thesis with measuring of wetting characteristics by the wetting balance method for samples of different surface finishes from the firm Gatema. It deals with influence of the isothermal aging and reflow processes on wetting characteristics of surface finishes ENIG, HAL and immersion tin. The influence of intermetallic layer on the overall wettability is studied in case of the surface finish of immersion tin. Also deals with the wettability of the nickel layer, after stripped off gold, in case of the surface finish of ENIG.
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Immersion Tin Surface Finish of PCB
Karzel, Vítězslav ; Zatloukal, Miroslav (referee) ; Starý, Jiří (advisor)
The aim of this work is to study and more deeply understand everything about surface finishing of the printed circuit boards, that are used for lead-free soldering. Mainly we should focus on immersion tin and prepare some fundamental information for future measurement. Therefore, in the first part of the thesis is our main task is to create a~sufficient theoretical background for printed circuit boards, immersion tin and solderability. Then we are able to use previously created theoretical background to measure selected samples. Thereafter the measured data can be used for more strict evaluation, from which the results of measurement can be obtained.
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Quality of PCB Surface Finishes and Test Coupon Optimization
Minář, Jan ; Přikryl, Tomáš (referee) ; Starý, Jiří (advisor)
This master’s thesis deals with measuring and evaluation of wetting for samples of different surface finishes, using a test coupon developed in cooperation with firm Gatema. It deals with surface finishes ENIG and immersion tin. For these samples deals with quality monitoring and periodic testing of these surface finishes. The solder using for tests is SAC305. Test methods are used for simulation of reflow soldering and wave soldering.
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Wettability of PCB Surface Finishes and Comparison of Methods
Vídeňský, Ondřej ; Přikryl, Tomáš (referee) ; Starý, Jiří (advisor)
This bachelor´s thesis deals with testing methods for surface finishe´s wettability PCB. For this tests has been designed and created testing board which contains testing coupons for testing methods. Boards have been created and covered by surface finishes by Gatema Boskovice. In this thesis electroless nickel with immersion gold (ENIG) and immersion tin have been tested. For simulation of reflow soldering have been used test methods solder indicator, solder spread test and dewetting test. Wetting balance test method has been used as simulation of wave soldering.
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WETTABILITY OF PCB SURFACE FINISHES
Minář, Jan ; Jana, Toulová (referee) ; Starý, Jiří (advisor)
This bachelor’s thesis with measuring of wetting characteristics by the wetting balance method for samples of different surface finishes from the firm Gatema. It deals with influence of the isothermal aging and reflow processes on wetting characteristics of surface finishes ENIG, HAL and immersion tin. The influence of intermetallic layer on the overall wettability is studied in case of the surface finish of immersion tin. Also deals with the wettability of the nickel layer, after stripped off gold, in case of the surface finish of ENIG.
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